UNISEM (M) BHD UNISEM
Unisem (M) Berhad, together with its subsidiaries, is engaged in the manufacture and sale of semiconductor devices and the provision of related services. It offers an integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding and also a range of leadframe and substrate integrated circuit packaging, high-end radio frequency and mix-signal test services. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. It has operations in Malaysia, the United Kingdom, the People's Republic of China, Indonesia, and the United States. The company is headquartered in Kuala Lumpur, Malaysia.
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